With the continuous advancement of technology, epoxy AB potting glue has become an indispensable material in the circuit board packaging process.As a two-component epoxy resin potting adhesive, it not only has excellent electrical and mechanical properties, but also has the characteristics of easy operation and high reliability. Therefore, it is widely used in the field of circuit board packaging. Read More

Epoxy resin AB glue is a two-component high temperature resistant adhesive based on epoxy resin. AB glue is mainly used for bonding high temperature resistant metals, ceramics, etc.The operating temperature is -50~+180℃, and can reach +250℃ in a short time.Mainly used for bonding of high temperature resistant parts such as metal to metal, ceramic to metal, ceramic to ceramic, such as bonding of high temperature resistant parts such as motors of model aircraft, etc. Read More

Issues to consider when choosing epoxy resin potting glue , Epoxy resin potting glue use steps and Analysis of common problems in epoxy resin potting operation. Read More