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Use and precautions of epoxy resin potting glue

Views: 1001     Author: Tina     Publish Time: 2024-07-31      Origin: Site

Issues to consider when choosing epoxy resin potting glue:

1. The requirements of the product for the performance of the potting glue, such as the use temperature, hot and cold alternation, the internal stress of the components, whether it is used outdoors or indoors, the stress conditions, whether it requires environmental protection, flame retardancy and thermal conductivity, color requirements, etc.

2. The potting process used in the product: manual or automatic potting, room temperature or heating curing, the time required for gluing after mixing, the gel solidification time, the complete curing time, etc.

Epoxy resin potting adhesive(1)



Epoxy resin potting glue use steps:

1. The products to be potted should be kept dry and clean;

2. When using, please check Agent A first to see if there is any sedimentation, and stir Agent A thoroughly;

3. Take the amount according to the ratio and weigh it accurately. Please remember that the ratio is weight ratio rather than volume ratio. After mixing A and B agents, stir them thoroughly to avoid incomplete curing;

4. After stirring evenly, please fill the glue in time and try to use up the mixed glue within the usable time.

5. After pouring, the glue will gradually penetrate into the gaps of the product. If necessary, please perform a second pouring.

6. During the curing process, please keep the environment clean to prevent impurities or dust from falling onto the surface of the uncured glue.

Electronic component potting glue



Analysis of common problems in epoxy resin potting operation:

1. Glue does not cure

Possible reasons: Too little or too much curing agent, glue A has been stored for a long time, and it was not stirred or not stirred evenly before use.

2. The glue that should be hard glue is soft after curing

Possible reasons: Incorrect glue ratio: For example, the glue is not mixed according to the weight ratio or the deviation is large, glue A has been stored for a long time, and it is not stirred or not stirred evenly before use.

3. Some glue is cured, some glue is not cured or is not completely cured

Possible reasons: Uneven stirring, Glue A has been stored for a long time, and it was not stirred or not stirred evenly before use.

4. The glue surface is very uneven or has many bubbles after curing

Possible reasons: curing too fast, heating curing temperature is too high, potting and dispensing is close to or exceeds the operation time.

5. After curing, the glue surface is oily

Possible reasons: there is water in the glue pouring process, it is too humid, glue A has been stored for a long time, and it is not stirred or not stirred evenly before use.


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