Electronic encapsulation adhesives are used to encapsulate electronic devices, providing protection against water, moisture, shock, dust, corrosion, and heat dissipation. Epoxy resins, due to their excellent heat resistance, electrical insulation, adhesion, and mechanical properties, have become a widely used encapsulation material. Read More

Epoxy resin potting compounds offer strong chemical resistance, excellent adhesion, and insulation properties, but require careful preparation, accurate mixing, and attention to temperature and curing time for optimal performance. Read More