What Do You Know about Epoxy Resins Used in High-performance Electronic Packaging Materials?

Electronic encapsulation adhesives are used to encapsulate electronic devices, serving as sealants, encapsulants, or potting agents. After encapsulation, electronic encapsulation adhesives provide waterproofing, moisture protection, shock resistance, dustproofing, corrosion protection, heat dissipation, and security. Therefore, electronic encapsulation adhesives need to possess characteristics such as high and low temperature resistance, high dielectric strength, good insulation, and environmental safety.

With the continuous development of large-scale integrated circuits and the miniaturization of electronic components, the heat dissipation problem of electronic components has become a key issue affecting their service life, and there is an urgent need for high thermal conductivity adhesives with good heat dissipation performance as encapsulation materials.

Epoxy resin possesses excellent heat resistance, electrical insulation, adhesion, dielectric properties, mechanical properties, low shrinkage, and chemical resistance. With the addition of a curing agent, it also exhibits good processability and workability. Therefore, epoxy resin is widely used for encapsulation of semiconductor devices abroad.

To address issues such as high temperature resistance and low water absorption, domestic and international research has focused on molecular structure design, primarily on blending modification and the synthesis of novel epoxy resins. On one hand, biphenyl, naphthalene, sulfone groups, and fluorine elements are introduced into the epoxy backbone to improve the moisture and heat resistance of the cured material. On the other hand, by adding several representative curing agents, the curing kinetics, glass transition temperature, thermal decomposition temperature, and water absorption of the cured products are studied, striving to prepare high-performance epoxy resins for electronic packaging materials.