Introduction to Epoxy Resins for High-Performance Electronic Packaging Materials

Electronic encapsulation adhesives are used to encapsulate electronic devices, serving as sealants, packaging, or potting agents. They provide waterproofing, moisture-proofing, shockproofing, dustproofing, corrosion resistance, heat dissipation, and confidentiality. Therefore, electronic encapsulation adhesives must be resistant to high and low temperatures, possess high dielectric strength, excellent insulation, and be environmentally friendly and safe.

With the continuous development of large-scale integrated circuits and the miniaturization of electronic components, heat dissipation has become a critical issue affecting the service life of electronic components. Highly thermally conductive adhesives with excellent heat dissipation performance are urgently needed as packaging materials.

Epoxy resins offer excellent heat resistance, electrical insulation, adhesion, dielectric properties, mechanical properties, and minimal processability and operability. Therefore, epoxy resins are currently widely used for encapsulation of semiconductor devices abroad.

With the growing calls for environmental protection and the continuous improvement of the integrated circuit industry's requirements for the performance of electronic packaging materials, higher requirements have been placed on epoxy resins. In addition to high purity, low stress, thermal shock resistance and low water absorption are also issues that need to be addressed urgently.