Introduction of potting glue

Potting is the process of mechanically or manually pouring liquid compounds into devices containing electronic components and circuits, and curing them at room temperature or under heating conditions to become thermosetting polymer insulating materials with excellent performance.

The role of potting:

1. Strengthen the integrity of electronic devices and improve resistance to external impact and vibration;

2. Improve the insulation between internal components and circuits, which is conducive to the miniaturization and lightweight of devices;

3. Avoid direct exposure of components and circuits, improve the waterproof and moisture-proof performance of devices, and improve the performance and stability parameters.

Types of potting compounds: Because of different materials, potting compounds can be roughly divided into three categories according to the more common applications on the market: silicone potting compounds, polyurethane potting compounds, and epoxy resin potting compounds.

Epoxy resin potting glue generally has high hardness after curing, has strong adhesion to metal parts and most plastics, is acid-resistant, alkali-resistant, corrosion-resistant, waterproof and insulating, has high adhesion and confidentiality characteristics, and is the most widely used and largest type of potting glue; it has good adjustable fluidity and can penetrate into every corner of electronic components. After curing, it has good acid and alkali resistance and no bubbles. During construction, it can be cured at room temperature or medium temperature, which can shorten the construction time. The properties of the cured product can be adjusted to various hardness, high temperature resistance, thermal conductivity, flame retardancy, etc.