High-performance Electronic Packaging Adhesive

Electronic encapsulation adhesives are used to encapsulate electronic devices, providing sealing, encapsulation, or potting. They provide waterproofing, moisture-proofing, shockproofing, dustproofing, corrosion resistance, heat dissipation, and confidentiality. Therefore, electronic encapsulation adhesives must be resistant to high and low temperatures, possess high dielectric strength, excellent insulation, and be environmentally friendly and safe.

With the continuous development of large-scale integrated circuits and the miniaturization of electronic components, heat dissipation has become a key issue affecting the service life of electronic components. Highly thermally conductive adhesives with excellent heat dissipation properties are urgently needed as packaging materials. Epoxy resins offer excellent heat resistance, electrical insulation, adhesion, dielectric properties, mechanical properties, minimal shrinkage, and chemical resistance. The addition of a curing agent also offers good processability and operability. Therefore, epoxy resins are currently widely used for encapsulation of semiconductor devices abroad.

With growing calls for environmental protection and the integrated circuit industry's increasing performance requirements for electronic packaging materials, higher demands are being placed on epoxy resins. In addition to high purity, epoxy resins used in IC packaging also require low stress, thermal shock resistance, and low water absorption, which are also pressing issues to be addressed. To address these issues, research at home and abroad, focusing on molecular structure design, has primarily focused on blending, modification, and the synthesis of novel epoxy resins. On the one hand, groups such as biphenyl, naphthalene, and sulfone, as well as fluorine, are introduced into the epoxy backbone to improve the moisture and heat resistance of the cured material. On the other hand, by adding several representative curing agents, the curing kinetics, glass transition temperature, thermal decomposition temperature, and water absorption of the cured product are studied, striving to produce high-performance epoxy resins for electronic packaging.